Self-cooling

A thermoelectric self-cooling system with forced air cooling based on a finned plate heat sink (case-a) and a water cooling based on a microchannel heat sink (case-b) is evaluated through a thermodynamic model.

Previous attempts at designing self-cooling microchips have largely relied on a two-pronged approach, involving designing the cooling elements separately from the electronic elements, and then combining after the initial fabrication process.